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情報來源：
https://tinyurl.com/y8623bnb

原本傳言iPhone 12會使用高通7nm X55晶片，但新消息可能指向iPhone 12會用X60晶片

To the contrary, a paywalled snippet from DigiTimes today claims that Apple's
chipmaking partner TSMC will begin manufacturing A14 chips and Snapdragon X60
modems this month for use in upcoming iPhones slated for launch later in
2020. This is the first time that we have seen this possibility mentioned.

TSMC to start chip production for next-gen iPhones in June
TSMC will start manufacturing Apple's custom-designed A14 SoCs and Qualcomm's
X60 5G modem chips, with both set to power the upcoming iPhones slated for
launch later in 2020, using 5nm process technology in June, according to
industry sources.

Built on a 5nm process, the X60 packs higher power efficiency into a smaller
footprint compared to the X55. Smartphones equipped with the X60 will also be
able to aggregate data from both mmWave and sub-6GHz bands simultaneously to
achieve an optimal combination of high-speed and low-latency network coverage.

X60晶片用了5nm製程，更省電，晶片更小。
X60最大的優勢是可以同時接收 mmWave和sub-6Hz的訊號
不像X55需要切換

When the X60 was introduced in February, it seemed destined for 2021 iPhones
rather than 2020 ones, as Apple needs adequate time for testing and
production. Qualcomm itself said that 5G smartphones featuring the X60 are
expected to begin launching in early 2021, so this rumor should be treated
with a healthy dose of skepticism for now.

原本X60晶片發表的時候，看起來似乎是要用在2021 iPhone上，所以這個情報令人
存疑


心得：
原本我因為X55的關係，完全不考慮iPhone 12的
但如果用X60的話就可以考慮買了
以往高通的新晶片要到隔年才能退出是因為最先進製程被蘋果包走

但現在華為的訂單沒了
蘋果把剩下的都訂走
分一部分給高通生產X-60也不無可能
甚至如果高通願意授權蘋果直接整合X-60到SOC的話
那應該是最完美的

如果是這樣的話
那高通基本上是連合蘋果裱android了吧

Android綁865加X55成本就夠高了
數據晶片還比蘋果低一階的話情何以堪

今年是要被蘋果打爆了？

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