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您是否被 H M U Y Processor 搞的頭昏眼花呢？ 下面簡單列出一些不同點

Mobile 4th Generation Intel® Processor Family (Traditional, 2-chip)

Package Specifications:
 Ball Grid Array (BGA)       , 1364 Pins, for H-Processor Line w/ GT3 or GT2.
 Reduced Pin Grid Array (rPGA), 946 Pins, for M-Processor Line w/ GT2 or GT1.

Processor DIMM Support:
 Dual Core: 1 DIMM Per Channel,  dual-channel Maximum.
 Quad Core: 2 DIMM Per Channel,  dual-channel Maximum.

Thermal Design Power (TDP) Specifications:
 57W    Quad Core rPGA Processor with GT2 Graphics (M-Processor) (XE)

 47W    Quad Core  BGA Processor with GT3 Graphics (H-Processor)
 47W    Quad Core  BGA Processor with GT2 Graphics (H-Processor)
 47W    Dual Core  BGA Processor with GT2 Graphics (H-Processor)
 47W    Quad Core rPGA Processor with GT2 Graphics (M-Processor)

 37W    Quad Core  BGA Processor with GT2 Graphics (H-Processor)
 37W    Quad Core rPGA Processor with GT2 Graphics (M-Processor)
 37W    Dual Core rPGA Processor with GT2/GT1 Graphics (M-Processor)



Mobile 4th Generation Intel® Processor Family (ultrabook, 1-chip)

Package Specifications:
 Ball Grid Array (BGA)       , 1168 Pins, for U-Processor and Y-Processor Line

Processor DIMM Support:
 1 DIMM Per Channel,  dual-channel Maximum.

Thermal Design Power (TDP) Specifications:
 28W    U-Processor (Dual Core) with GT3 Graphics

 15W    U-Processor (Dual Core) with GT3 Graphics
 15W    U-Processor (Dual Core) with GT2 Graphics

 11.5W  Y-Processor (Dual Core) with GT1 or GT2 Graphics



結論都是 Mobile 的處理器....

補充: 記得看一下這篇 能夠了解8種 haswell 的封裝方式
IntelがHaswellの設計詳細をHot Chipsで発表
http://pc.watch.impress.co.jp/docs/column/kaigai/20130904_613951.html


References:

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◆ From: 106.1.24.106
※ 編輯: chrisdar        來自: 106.1.24.106         (02/23 14:46)

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